Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst Hybrid Bonding Process | PR Newswire [Video]

, /PRNewswire/ — Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S”, “we” or the “Company”), in collaboration with ROHM Co., Ltd (TYO: 6963) (“ROHM”), a producer of a wide-range of semiconductor devices, announces a new path to hybrid bonding leveraging Kulicke & Soffa’s leading Fluxless Thermo-Compression (FTC) process.

Kulicke & Soffa’s recently released APTURA™ FTC system, combined with technology innovations from ROHM, have successfully enhanced chip-to-wafer hybrid bonding with the innovative copper-first – CuFirst™ – hybrid solution. While existing die-to-wafer hybrid bonding capacity can enable significant I/O density – yield challenges, cost of ownership, and front-end processing requirements are limiting the adoption rate and market potential of existing hybrid solutions.

The CuFirst hybrid solution, utilizing the K&S APTURA FTC platform, addresses these production limitations and challenges. With the emerging CuFirst process, the copper interconnect is bonded first – leveraging the APTURA platform’s FTC capability – then the dielectric (SiOx) connection is made once the device …